pcb_emc设计准则(second_edition).doc

PCB_EMC设计准则(Second_Edition)


目錄
I. 基本觀念.………..…………..……………………………………………………..3
一、系統中的PCB EMC設計…………………………………………………………………...3
二、四層板與六層板的EMI特性分析…………………………………………………………..3
三、名詞說明………………………………………………………………………………………4
II. EMI零件…...………………………………………………………………………5
1. I/O Filter…………………………..……………………………………………………….……5
(1) LCD Connector………………..……………………………………………………….……5
(2) CRT Port………………..…………..………………………………………………….……5
(3) TV-Out Port………………..……………………………………………………….……….7
(4) Printer Port………………..……………………………………………………….………..8
(5) Serial Port………………..……………………………………………………….…………8
(6) PS2 Port………………..……………………………………………………….…………...9
(7) USB Port………………..……………………………………………………….……….….9
(8) 1394 Port………………..……………………………………………………….…………10
(9) Audio Port………………..……………………………………………………….………..10
(10) Internal Speaker/MIC Connector………………..………………………………………..11
(11) Battery Connector………………….………………………………………………….….11
(12) Inverter Connector………………….……………………………………………….……12
(13) Docking Connector(Portbar, Portdock, Port Replicator,…) ………………..……………12
(14) LAN Port…………………..…………………………………………………….………..13
(15) RJ-11 Port (Trace on Board) …………………..…………………………………………14
(16) DC-IN Jack…………………..…………………………………………………….……..14
(17) Daughter Board (VGA/ Power/ Audio/ MDC Board,…等) Connector……………….....15
(18) Small Board (LED/ Switch/ Touchpad,…等有引Cable的小板) Connector…………….15
(19) Fan, RTC Battery Connector……………………………………………………………..15
2. Capacitor at Moat…...…………….……………………………………………..…………….15
3. Capacitor at Power Polygon…………………………………………………………………...15
III. LAYOUT…….…...……………….……………………………….…………….16
1. Layer Stacking…..……………………………………………………………………………..16
□ 四層板…..………………………………………………………………………………....16
□ 六層板…..…………………………………………………………………………..……..16
□ 八層板…..……………………………………………………………………………..…..17
◎ Prepreg Thickness……………………..…………………………………………………..17
◎ Prepreg Cost…………………...…………………………………………………..………17
2. Placement………………………………………………………….………………………..….18
3. Power Plane……………………………………………………………………………………19
4. Ground Plane………………………….……………………………………………………….21
5. Signal Routing…………………………………………………………………………………22
[1] 四層板（1-G-P/G-4）………………..…………………………………….……………..22
[2] 六層板（1-G-3-4-P/G-6）………………………………………………………………….23
[3] 八層板（1-G-3-P-5-6-G-8）……………………………………………………………….24
[4] Daughter Board（VGA/ Power/ Audio Board,…）……………………………………….25
[5] Small Board（轉板/ LED/ Switch Board , Touchpad FPC,…）………………………….25
（圖A）四層板或六層板走在鄰近VCC Layer的Clock Trace……………………………26
（圖B）LCD Connector範例1………………………………………………………………26
（圖C）LCD Connector範例2………………………………………………….……………27
（圖D）Clock Generator範例…………………………………………………….….………27
（圖E）R/G/B Trace範例……………………………………………….….…………..……28
（圖F）I/O Capacitor連接方式範例……………………………………….…….….………28
◎ Reference Books…………………………………………………………...……29