表面氧化物在无铅软钎料纳米线和纳米棒熔化中的影响_外文翻译.zip
表面氧化物在无铅软钎料纳米线和纳米棒熔化中的影响_外文翻译,翻译共15页 英翻中effect of surface oxide on the melting behavior of lead-free solder nanowires andnanorodslead-free nanosolders have shown promise in nanowire and nano...
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翻译共15页 英翻中
Effect of surface oxide on the melting behavior of lead-free solder nanowires andnanorods
Lead-free nanosolders have shown promise in nanowire and nanoelectronics assembly. Among variousimportant parameters, melting is the most fundamental property affecting the assembly process. Herewe report that the melting behavior of tin and tin/silver nanowires and nanorods can be signi?cantlyaffected by the surface oxide of nanosolders. By controlling the nanosolder reflow atmosphere using aflux, the surface oxide of the nanowires/nanorods can be effectively removed and complete nanosoldermelting can be achieved. The complete melting of the nanosolders leads to the formation of nanoscale tomicroscale spherical solder balls, followed by Ostwald ripening phenomenon. The contact angle of themicroscale solder balls formed on Si substrate was measured by direct electron microscopic imaging.These results provide new insights into micro- and nanoscale phase transition and liquid droplet coales-cence from nanowires/nanorods to spheroids, and are relevant to nanoscale assembly and smaller ballgrid array formation.
无铅纳米钎料已经证明了在纳米线和纳米电子组件的作用。在各种重要参数中，熔点是影响装配过程中的最基本特性。在我们的报告中指出，无铅钎料的表面氧化可以显著的影响Sn和Sn-Ag纳米线，纳米棒的熔融。通过控制纳米焊料回流气氛，使用焊剂以有效去除纳米线/纳米棒的表面氧化物，以及完成纳米焊料的熔化。纳米焊料的完全融化会导致纳米到微米级焊料球的形成以及奥斯特瓦尔德熟化现象。微尺度的焊锡球的接触角在Si衬底上形成，可以直接通过电子显微镜成像测量。这些结果为微型、纳米相变、液滴聚结的纳米线/纳米棒的球体以及相关的纳米组装和小球网络阵列的形成提供了新的见解。
Effect of surface oxide on the melting behavior of lead-free solder nanowires andnanorods
Lead-free nanosolders have shown promise in nanowire and nanoelectronics assembly. Among variousimportant parameters, melting is the most fundamental property affecting the assembly process. Herewe report that the melting behavior of tin and tin/silver nanowires and nanorods can be signi?cantlyaffected by the surface oxide of nanosolders. By controlling the nanosolder reflow atmosphere using aflux, the surface oxide of the nanowires/nanorods can be effectively removed and complete nanosoldermelting can be achieved. The complete melting of the nanosolders leads to the formation of nanoscale tomicroscale spherical solder balls, followed by Ostwald ripening phenomenon. The contact angle of themicroscale solder balls formed on Si substrate was measured by direct electron microscopic imaging.These results provide new insights into micro- and nanoscale phase transition and liquid droplet coales-cence from nanowires/nanorods to spheroids, and are relevant to nanoscale assembly and smaller ballgrid array formation.
无铅纳米钎料已经证明了在纳米线和纳米电子组件的作用。在各种重要参数中，熔点是影响装配过程中的最基本特性。在我们的报告中指出，无铅钎料的表面氧化可以显著的影响Sn和Sn-Ag纳米线，纳米棒的熔融。通过控制纳米焊料回流气氛，使用焊剂以有效去除纳米线/纳米棒的表面氧化物，以及完成纳米焊料的熔化。纳米焊料的完全融化会导致纳米到微米级焊料球的形成以及奥斯特瓦尔德熟化现象。微尺度的焊锡球的接触角在Si衬底上形成，可以直接通过电子显微镜成像测量。这些结果为微型、纳米相变、液滴聚结的纳米线/纳米棒的球体以及相关的纳米组装和小球网络阵列的形成提供了新的见解。
