高速电路板级sipi与实践.doc

高速电路板级SI、PI与实践



目  录

一 论文正文

1绪论 1

  1.1 SI与PI基本原则 1

    1.2 信号完整性分析、电源完整性分析简介 2

2 SI的仿真与设计 3

    2.1 信号完整性分析定义与对象 3

    2.2 信号完整性问题 4

  2.3 SI的HyperLynx 仿真 13

3 PI仿真与设计 23

  3.1 概述 23

  3.2 电源系统的噪声来源与电容的退耦 24

  3.3 PI的仿真分析 27

4总结与实例 32

参考文献 34

谢辞 35

二 附录

论文（设计）任务书 36

论文（设计）结题报告 38

论文（设计）成绩评定及答辩评议表 40

论文（设计）答辩过程记录 42

摘要：随着PCB 设计越来越复杂，设计周期越来越短，信号完整性仿真分析正变得越来越重要。本文简介了信号完整性针对的基本问题，介绍了基于信号完整性仿真分析的高速PCB设计方法，并结合一个高速PCB 设计案例，通过Mentor Graphics公司电路系统仿真工具——HyperLynx，对高速板级电路进行仿真。研究通过改变传输线参数、干扰源、地平面介质对串扰的影响。根据PCB厂家的制版参数匹配出阻抗线。仿真分析出层间结构、布局、布线规则和一些端接方案，完成仿真板级结果。

关键词：信号完整性；信号完整性仿真 IBIS；串扰；传输线；HyperLynx仿真

High-speed circuit board level SI、PI and practice

Abstract: with the PCB design more and more complex, the design cycle more and more short, signal integrity simulation analysis is becoming more and more important. In this paper are introduced the signal integrity in the basic problem, introduces the simulation analysis based on signal integrity of the PCB design method, and combining with a high speed PCB design case, through the Mentor Graphics company circuit system simulation tools-HyperLynx, for high-speed circuit board level simulation. Research by changing the parameters of the transmission line, interference sources, ground plane media on the influence of crosstalk. According to the PCB manufacturer plate parameters matching the impedance line. The simulation analysis between the layer structure, layout and wiring rules and some termination program, complete simulation board level results.

Key words:Signal Integrity（SI ）;SI Simulation;IBIS;Crosstalk;transmission lines;HyperLynx simulation