ic晶片邦定机控制系统设计（本科毕业论文）.doc

IC晶片邦定机控制系统设计（本科毕业论文）

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中文摘要

现在，在多数的电子设备中都会用到晶片。晶片是实集成电路等电子器件中不可缺少的部件。邦定机是封装行业中很重要的设备
集成电路（IC）产业已成为国民经济发展的关键，而IC 设计、制造和封装测试是IC 产业发展的三大产业之柱。我国IC封装业一直是IC产业链中的第一支柱产业。据统计，2007年国内集成电路封装测试业共实现销售收入627.7亿元，同比增长26.4%，继续保持了快速发展势头 。但是，我国主要是在低端方面，而在新技术发面，我们远远落后在国外同行业后面。
邦定机是封装行业中很重要的设备，我们本次的设计虽然不能改变什么，但我们可以从中了解我国的概况，引起我们的重视，从而迎头赶上国外。此次设计是学生设计，我们可以从中学到很多：对综合知识的应用，掌握机电系统典型零件的计算方法及正确的结构设计方法，树立我们独立的设计思想，培养我们分析问题的能力，对资料的收集，对问题的发现与解决，对新设计的设计步骤等等。
在这过程中，我们主要通过查资料，参考现成的产品等方法去完成此次设计。
设计出的邦定机在很大程度上是不完善的，相对于参考的AB520邦定机，在体型，功能等方面都有很大的不足，这主要是受限于知识与经验等方面的原因。但是我相信这会是一次很好的锻炼机会
 
关键词：IC晶片，邦定机，控制系统

ABSTRACT

Now, in most electronic equipment will be used in the chip. IC chips are electronic devices is an indispensable component. Bonding machine industry is a very important package of equipment
Integrated circuit (IC) industry has become the key to national economic development, IC design, manufacturing and IC packaging and testing industry is the development of the three major industries of the column. China's IC packaging industry has been linked in the IC industry is the first pillar industries. According to statistics, in 2007 the domestic IC packaging and testing industry realized a total sales income of 62.77 billion yuan, an increase of 26.4 percent, continuing to maintain a momentum of rapid development. China, however, mainly in the low-end, while the new technology Famian, we lag far behind foreign countries in the same industry behind.
Bonding machine industry is a very important package of equipment, the design of this we can not change what, but we can learn from China's profile has aroused our attention, to catch up with foreign countries. The design students design, we can learn a lot from: comprehensive knowledge of the application of mechanical and electrical systems have typical components of the calculation method and correct the structural design methods, establish our independent design ideas, nurture our ability to analyze problems, Data collection, the problem discovered and resolved, the design of the new design steps, and so on.
In this process, we mainly through investigations, information and off-the-shelf products, such as methods to complete the design.
The state will design a machine to a large extent be imperfect. Compared to the reference AB520 bonding machine, the size, functions and other aspects of the great shortage, which is mainly limited knowledge and experience in the areas of reasons. However, I believe it would be a good training opportunity

Key words: IC chip， bonding machine, control system