单晶硅微米压痕过程的有限元分析（本科毕业论文设计）.doc
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单晶硅微米压痕过程的有限元分析（本科毕业论文设计）,摘要随着微、纳米科技的蓬勃发展，微、纳米级材料在电子信息、生物工程、医学、医药、航空航天、国防等高新尖端领域得到了市场化的应用。因此人布门越来越多的关注材料在微、纳米尺度下的特性。通过压头对材料表面加载，然后测出压痕区域，以此来评价材料机械性能这项技术，我们称之为压痕技...
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单晶硅微米压痕过程的有限元分析（本科毕业论文设计）
摘 要
随着微、纳米科技的蓬勃发展，微、纳米级材料在电子信息、生物工程、医学、医药、航空航天、国防等高新尖端领域得到了市场化的应用。因此人布门越来越多的关注材料在微、纳米尺度下的特性。通过压头对材料表面加载，然后测出压痕区域，以此来评价材料机械性能这项技术，我们称之为压痕技术。由于超薄层(一些涂层及复合材料界面层等)的厚度达到亚微米级甚至纳米级，传统的压痕方法己经不适用。一种崭新的材料测试技术—微、纳米压痕技术应运而生。
本文是采用Marc软件模拟了微、纳米压痕仪的加载过程，三维有限元模型考虑了微米压痕仪的标准球形压头。介绍了有限元模型的几何参数、边界条件、材料特性与加载过程，讨论了系列载荷下球形压头有限元仿真后的载荷—压入深度的分析、弹塑性分析球形压头典型载荷有限元仿真结果分析以及试件模型的大小对计算结果的影响。在此基础上，重点讨论压头的材料压痕载荷—位移曲线，分析单晶硅材料的弹塑性性能。展望未来，对本课题提出的问题可以通过软件实现自动优化，以得到材料的弹塑性性能。无疑这将为单晶硅的广泛应用奠定坚实的基础，在促进电子信息发展也有很大的作用。
关键词：微米压痕试验，弹塑性接触，单晶硅，有限元分析
ABSTRACT
With the booming of Micro/Nanotechnology, the applications of micro/nano-scale materials are mainly industry of Electronic Engineering, Biologic Engineering, Medicine Science and Aerospace. Therefore, people pay more and more attentions to the macro/nano-scale materials. However, the traditional method of testing materials is not applicable to these materials. A novel mether—micro/nanoindentation was proposed, which is a new technology to measure materialties. The displacement of the indenter (0.1~l00nm) is monitored and recorded during the experiments.Therefore, a relationship between load and displacemt is obtained after the experiments, which can be used to analyze the elastic properties of the material.
This paper is a software simulation of the micro-Marc, Nanoindentation for the loading process, 3-D finite element model to consider a micron indentation for the standard spherical pressure head. Introduced a finite element model of geometric parameters, boundary conditions, material properties and the loading process, to discuss a series of load spherical pressure head FEM after the load - the pressure to the depth of analysis, elastic-plastic spherical pressure head of a typical load finite element The simulation results and analysis of the sample size model of the impact of the results. On this basis, the discussion focused on the pressure head of indentation load - displacement curve, the analysis of the silicon material Elastoplastic performance. Looking to the future, subject to the questions raised by software for automatic optimization, in order to get the elastic-plastic material properties. No doubt this will be the wider use of monocrystalline silicon and lay a solid foundation in promoting the development of electronic information have great role to play.
Key words： Micro-indentation, Elastic-plastic contact, Monocrystal silicon, Finite element analysis
目 录
摘要 I
ABSTRACT II
1 绪论 1
1.1 课题的目的及意义 1
1.2 国内外的研究现状 2
1.2.1 微米压痕技术的理论与实验研究 2
1.2.3 弹塑性接触力学问题的理论研究 4
1.3 课题任务、重点研究内容、实现途径 5
1.3.1 课题任务 5
1.3.2 主要研究内容与实现途径 5
2 微米压痕实验与接触力学分析 7
2.1微米压痕实验 7
2.2 接触力学模型 9
2.2.1 Hertz接触模型 9
2.2.2弹塑性接触模型 9
2.2.3 屈服准则 10
3 有限元方法及Marc软件的简介 14
3.1 有限元方法 14
3.1.1 有限元方法概述 14
3.1.2 有限元方法的求解 15
3.2 MSC.Marc软件介绍 18
3.2.1 Marc的主要模块与分析流程 18
3.2.2 Marc的接触分析功能 20
4 单晶硅微米压痕实验的有限元分析 21
4.1 建立有限元模型 21
4.2 计算结果分析 24
4.2.1 弹性接触分析 24
4.2.2 弹塑性接触分析 26
4.2.3 弹性与弹塑性接触行为的比较 30
4.3 结论 33
致谢 35
参考文献 36
摘 要
随着微、纳米科技的蓬勃发展，微、纳米级材料在电子信息、生物工程、医学、医药、航空航天、国防等高新尖端领域得到了市场化的应用。因此人布门越来越多的关注材料在微、纳米尺度下的特性。通过压头对材料表面加载，然后测出压痕区域，以此来评价材料机械性能这项技术，我们称之为压痕技术。由于超薄层(一些涂层及复合材料界面层等)的厚度达到亚微米级甚至纳米级，传统的压痕方法己经不适用。一种崭新的材料测试技术—微、纳米压痕技术应运而生。
本文是采用Marc软件模拟了微、纳米压痕仪的加载过程，三维有限元模型考虑了微米压痕仪的标准球形压头。介绍了有限元模型的几何参数、边界条件、材料特性与加载过程，讨论了系列载荷下球形压头有限元仿真后的载荷—压入深度的分析、弹塑性分析球形压头典型载荷有限元仿真结果分析以及试件模型的大小对计算结果的影响。在此基础上，重点讨论压头的材料压痕载荷—位移曲线，分析单晶硅材料的弹塑性性能。展望未来，对本课题提出的问题可以通过软件实现自动优化，以得到材料的弹塑性性能。无疑这将为单晶硅的广泛应用奠定坚实的基础，在促进电子信息发展也有很大的作用。
关键词：微米压痕试验，弹塑性接触，单晶硅，有限元分析
ABSTRACT
With the booming of Micro/Nanotechnology, the applications of micro/nano-scale materials are mainly industry of Electronic Engineering, Biologic Engineering, Medicine Science and Aerospace. Therefore, people pay more and more attentions to the macro/nano-scale materials. However, the traditional method of testing materials is not applicable to these materials. A novel mether—micro/nanoindentation was proposed, which is a new technology to measure materialties. The displacement of the indenter (0.1~l00nm) is monitored and recorded during the experiments.Therefore, a relationship between load and displacemt is obtained after the experiments, which can be used to analyze the elastic properties of the material.
This paper is a software simulation of the micro-Marc, Nanoindentation for the loading process, 3-D finite element model to consider a micron indentation for the standard spherical pressure head. Introduced a finite element model of geometric parameters, boundary conditions, material properties and the loading process, to discuss a series of load spherical pressure head FEM after the load - the pressure to the depth of analysis, elastic-plastic spherical pressure head of a typical load finite element The simulation results and analysis of the sample size model of the impact of the results. On this basis, the discussion focused on the pressure head of indentation load - displacement curve, the analysis of the silicon material Elastoplastic performance. Looking to the future, subject to the questions raised by software for automatic optimization, in order to get the elastic-plastic material properties. No doubt this will be the wider use of monocrystalline silicon and lay a solid foundation in promoting the development of electronic information have great role to play.
Key words： Micro-indentation, Elastic-plastic contact, Monocrystal silicon, Finite element analysis
目 录
摘要 I
ABSTRACT II
1 绪论 1
1.1 课题的目的及意义 1
1.2 国内外的研究现状 2
1.2.1 微米压痕技术的理论与实验研究 2
1.2.3 弹塑性接触力学问题的理论研究 4
1.3 课题任务、重点研究内容、实现途径 5
1.3.1 课题任务 5
1.3.2 主要研究内容与实现途径 5
2 微米压痕实验与接触力学分析 7
2.1微米压痕实验 7
2.2 接触力学模型 9
2.2.1 Hertz接触模型 9
2.2.2弹塑性接触模型 9
2.2.3 屈服准则 10
3 有限元方法及Marc软件的简介 14
3.1 有限元方法 14
3.1.1 有限元方法概述 14
3.1.2 有限元方法的求解 15
3.2 MSC.Marc软件介绍 18
3.2.1 Marc的主要模块与分析流程 18
3.2.2 Marc的接触分析功能 20
4 单晶硅微米压痕实验的有限元分析 21
4.1 建立有限元模型 21
4.2 计算结果分析 24
4.2.1 弹性接触分析 24
4.2.2 弹塑性接触分析 26
4.2.3 弹性与弹塑性接触行为的比较 30
4.3 结论 33
致谢 35
参考文献 36
